Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).

The semiconductor ceramic packaging materials market is set to expand from USD 1.85 billion in 2025 to USD 2.78 billion by ...

DALLAS, July 16, 2024 /PRNewswire/ -- Texas Instruments (TXN) today introduced six new power modules designed to improve power density, enhance efficiency and reduce EMI. These power modules leverage ...

These ultra-tiny power modules developed by Texas Instruments, which are 23% smaller than competing devices, also improve power density and efficiency. 1. New power modules built with MagPack ...

In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...

The power semiconductor market is poised for remarkable growth in the next several years, fueled by the adoption of electric vehicles and renewable energy, but it also driving big changes in the ...

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...

Infineon Technologies AG has released the next generation of high-density power modules, supporting AI and high-performance data-center compute. Data centers represent two percent of global energy ...